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发表于 2007-7-9 17:02:01
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小弟见过一种测量薄膜应力的仪器,描述如下
The standard stress measurement technique is straightforward: one measures the curvature of the substrate prior to
deposition, then measures the substrate along the same trace after a film is applied. The stress measurement
analysis uses the bending plate method to calculate stress in a deposited thin film layer, based upon the change in
curvatures of the film and substrate. |
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