微通道板双面抛光过程材料去除特性研究

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微通道板双面抛光过程材料去除特性研究
Material Removal Property in Double-sided Polishing Process  for Microchannel Plates
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作　　者：张洋 黄永刚 刘辉 王云 吕学良
ZHANG Yang, HUANG Yong-gang, LIU Hui, WANG Yun, LYU Xue-liang  （China Building Materials Academy, Beijing 100024, China）
机构地区：中国建筑材料科学研究总院,北京100024
出　　处：《红外技术》 CSCD 2014年第36卷第4期 336-342页,共7页
Infrared Technology
摘　　要：材料去除率是表征双面抛光加工效率的重要参数，也是影响工件表面质量的关键因素。基于双面抛光加工中工件运动过程的分析，通过向量法构建了工件上任一点的运动轨迹及其相对速度的数学模型。运用Preston模型，建立双面抛光过程中材料去除特性方程，并辅助计算机软件模拟了不同工艺条件下的材料去除特性。最后，通过微通道板的双面抛光实验，研究了不同工艺参数下的材料去除量，验证了理论模拟的正确性。
The material removal rate is an important parameter to indicate the fabricate efficiency in double-sided polishing process, it also has an important influence on the surface quality of the workpieces. The mathematical models of motion trajectory and relative velocity of any point on the workpiece are established using the vector method, after analyzing the motion process of double-sided polishing. Based on the Preston model, the material removal property equation in double-sided polishing is established. And the material removal property under different parameters is simulated by computer software. Finally, the microchannel plates are carried out for the double-sided polishing experiments. The results of material removal quantity under different parameters are consistent with theory simulation.
关键词：光学加工 材料去除特性 双面抛光 微通道板 数学模拟
optical processing, material removal property, double-sided polishing, microchannel plate,mathematical simulation ;

gb936

MCP双面抛光

阿明

非常感谢！交给朋友吧！